epoxy resin adhesive
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H907-K low-temperature fast-curing one-component epoxy resin adhesive, 80-degree curing epoxy resin
H907-K series non solvent single component low-temperature fast curing epoxy resin products have low coefficient of linear expansion, high temperature resistance, impact resistance, vibration resistance, and high hardness. Widely used for bonding and fixing el...
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H907-HF-Z magnetic core center column adhesive, single-component elastic epoxy resin adhesive, trans
The non-solvent and low halogen H907-HF-Z is a general one-component flexibility epoxy adhesive, which widely used in electronic and electric fields. It's been widely applied in the bonding and fixation of various electronic components, electrical applianc...