H907-K low-temperature fast-curing one-component epoxy resin adhesive, 80-degree curing epoxy resin

H907-K series non solvent single component low-temperature fast curing epoxy resin products have low coefficient of linear expansion, high temperature resistance, impact resistance, vibration resistance, and high hardness. Widely used for bonding and fixing electronic components, handicrafts, and gifts, it has excellent bonding strength for packaging and bonding between metals, ceramics, glass, fiber products, and hard plastics; Recommended for bonding and fixing electronic components on circuit boards, medical products, disposable syringe needles, various microelectronic products, optoelectronic products, motors, inductors, iron cores or cores of high and low frequency transformers, and other products that require low-temperature curing or high-temperature fast curing.  

Appearance and physical properties

Appearance: viscous paste like body

Colors: black, gray, milky white

Specific gravity (25 ℃) 1.4-1.5

Viscosity (25 ℃) 35000-65000 CPS

Curing conditions: 80-90 ℃/30-60 minutes, 120 ℃ for 5-10 minutes;         

Characteristics after curing

Hardness Shore D 85-95

Hot wire expansion coefficient 6.7 × 10-5/℃

Surface resistance Ω - cm 5.5 × 1013

Shear strength Mpa 11

Insulation breakdown voltage kv/mm 18-20

Tensile strength Mpa 41

Temperature resistance range 150-180 ℃

A professional adhesive R&D and production enterprise! Started in 1999, because of our expertise, we believe we will do better

We have 4 production bases:

Dongguan Huachuang Insulation Materials Co., Ltd

Guangdong Huachuang Electronic Materials Co., Ltd

Zhuzhou Huachuang New Materials Technology Co., Ltd

Kunshan Huachuang Electronic Materials Co., Ltd

Contact: Mr. Lin

Phone: 18925770398

E-mail: cnhuac@163.com