Epoxy adhesive
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808AB-K, Fast curing epoxy potting adhesive, fast drying electronic potting adhesive
808AB-K series dual dosage form fast curing epoxy resin insulation sealing material is widely used in insulation infusion, bonding, moisture-proof sealing, etc. for electronic components, electronic transformers, charging stations, filters, negative ion genera...
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808AB-GT, High temperature resistant epoxy resin sealing adhesive, high temperature resistant electr
808AB-GT series dual dosage form high-temperature resistant epoxy resin insulation sealing material is widely used in insulation infusion, bonding, moisture-proof sealing, etc. for electronic components, electronic transformers, charging stations, filters, neg...
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808AB-DH, Thermal conductive epoxy sealant, thermal conductive electronic sealant, thermal conductiv
808AB-DH is a dual dose epoxy resin thermal insulation sealing material widely used in insulation infusion, bonding, moisture-proof sealing, etc. for electronic components, electronic transformers, charging stations, filters, negative ion generators, capacitor...
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909AB-K-5, Epoxy resin structural adhesive, epoxy AB adhesive, 5-minute curing AB adhesive, DP100
909AB-K-5 is a dual liquid fast curing epoxy resin structural adhesive used for rapid curing at room temperature or low temperature. After curing, the bonding layer has high hardness and can withstand strong impacts and vibrations. The bonding layer has good m...
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808AB， Epoxy resin potting adhesive, electronic potting adhesive, potting AB adhesive
808AB is a dual dose epoxy resin insulation sealing material widely used in insulation infusion, bonding, moisture-proof sealing, etc. for electronic components, electronic transformers, charging stations, filters, negative ion generators, capacitors, power mo...
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H907-HF-R， Elastic single component epoxy adhesive, soft epoxy adhesive, flexible single component e
H907-HF-R is a single component modified epoxy resin high elasticity adhesive widely used for bonding and fixing various electronic components, electrical appliances, electromechanical hardware, magnetic components, optoelectronic products, automotive parts co...
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H907-K low-temperature fast-curing one-component epoxy resin adhesive, 80-degree curing epoxy resin
H907-K series non solvent single component low-temperature fast curing epoxy resin products have low coefficient of linear expansion, high temperature resistance, impact resistance, vibration resistance, and high hardness. Widely used for bonding and fixing el...
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H907-HF-Z magnetic core center column adhesive, single-component elastic epoxy resin adhesive, trans
The non-solvent and low halogen H907-HF-Z is a general one-component flexibility epoxy adhesive, which widely used in electronic and electric fields. It's been widely applied in the bonding and fixation of various electronic components, electrical applianc...
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epoxy H907-HF,Hua Chuang epoxy adhesive,epoxy glue,high binding strength and hardness
PRODUCT DESCRIPTIONThe non-solvent and low halogen H907-HF is a general one-component epoxy adhesive, which widely used in electronic and electric fields. It's been widely applied in the bonding and fixation of various electronic components,...
