808AB， Epoxy resin potting adhesive, electronic potting adhesive, potting AB adhesive

808AB is a dual dose epoxy resin insulation sealing material widely used in insulation infusion, bonding, moisture-proof sealing, etc. for electronic components, electronic transformers, charging stations, filters, negative ion generators, capacitors, power modules, LED modules, circuit components, aquarium water pumps, power and electrical components, automotive parts, electromechanical hardware, optoelectronic lighting, etc. After mixing, the viscosity is low, the flowability is strong, and it has an appropriate operating time, making it easy to produce. The cured material has low shrinkage, bright surface, hardness, strong adhesion and sealing properties, excellent chemical resistance, and excellent electrical and physical properties.

Pre curing characteristics

   808A     808B

Appearance: Black liquid, brown liquid

Specific gravity g/cm3 1.45-1.55    0.95-1.05

Viscosity 25 ℃ CPS 7000-15000    50-150

Shelf life 6 months 6 months

Packaging: 5-25 kg, 1-5 kg

Mixing ratio A: B=5:1 (weight ratio)

Note: Long term storage of component A may result in precipitation. Before use, the entire bucket of component A should be stirred evenly; There is a certain probability that component A will crystallize due to large temperature differences and sustained low temperatures. In this case, simply heat component A to restore its liquid state and stir evenly before use.

Curing conditions

100g mixed adhesive can be used for 30-40 minutes at 25 ℃

Basic curing time at room temperature is 24 hours

The optimal strength time at room temperature is 5-7 days

Heating and curing time at 80 ℃ for 1-2 hours

Note: The usable interval and curing speed are related to the ambient temperature and the amount of glue injected at the time of operation. The specific results should be based on actual testing, and the appropriate amount of glue should be adjusted according to the ambient temperature and the actual application of the product.                                

Characteristics after curing

Hardness Shore D 75-85

Hot wire expansion coefficient PPM 60-80

Dielectric strength KV/MM 12

Insulation resistance Ω - cm 2.6 × 1013

Temperature resistance range ℃ -40--100

A professional adhesive R&D and production enterprise! Started in 1999, because of our expertise, we believe we will do better

We have 4 production bases:

Dongguan Huachuang Insulation Materials Co., Ltd

Guangdong Huachuang Electronic Materials Co., Ltd

Zhuzhou Huachuang New Materials Technology Co., Ltd

Kunshan Huachuang Electronic Materials Co., Ltd

Contact: Mr. Lin

Phone: 18925770398

E-mail: cnhuac@163.com