909AB-K-5, Epoxy resin structural adhesive, epoxy AB adhesive, 5-minute curing AB adhesive, DP100

909AB-K-5 is a dual liquid fast curing Epoxy resin structural adhesive used for rapid curing at room temperature or low temperature. After curing, the bonding layer has high hardness and can withstand strong impacts and vibrations. The bonding layer has good mechanical properties and electrical insulation, and can withstand temperature changes and flexural peel stress without corrosiveness; Widely used in various electronic components, electrical appliances, civil engineering, electromechanical hardware, magnetic components, optoelectronic products, auto parts components, as well as bonding, fixing, repairing and pouring of metals, ceramics, plastics, rubber, glass, fiber products, handicrafts, gemstones, etc. It can quickly locate and fix, and has high adhesion.

Pre curing characteristics

909A-K-5909B-K-5

Appearance: Transparent liquid, transparent yellow liquid

Specific gravity g/cm3 1.05-1.1 0.95-0.98

Viscosity 25 ℃ CPS 10000-20000 6000-12000

Shelf life 6 months 6 months

Packaging 1-25 kg 1-25 kg

Mixing ratio A: B=1:1 (weight ratio)

Note: There is a certain probability that component A will crystallize due to large temperature differences and sustained low temperatures. In this case, simply heat component A to restore its liquid state and stir evenly before use.

Curing conditions

100g mixed adhesive can be used for 2 minutes at 25 ℃

Basic curing time at room temperature 5-10 minutes

The optimal strength time at room temperature is 5-7 days

Heating at 80 ℃ for complete curing time of 1-2 hours

Note: The usable interval and curing speed are related to the ambient temperature and the amount of glue injected at the time of operation. The specific results should be based on actual testing, and the appropriate amount of glue should be adjusted according to the ambient temperature and the actual application of the product.                                

Characteristics after curing

The appearance of the cured material is slightly yellow and semi transparent

Hardness Shore D 75-85

Hot wire expansion coefficient PPM 50-70

Dielectric strength KV/MM 12

Insulation resistance Ω - cm 3.5 × 1013

Temperature resistance range ℃ -40--100

A professional adhesive R&D and production enterprise! Started in 1999, because of our expertise, we believe we will do better

We have 4 production bases:

Dongguan Huachuang Insulation Materials Co., Ltd

Guangdong Huachuang Electronic Materials Co., Ltd

Zhuzhou Huachuang New Materials Technology Co., Ltd

Kunshan Huachuang Electronic Materials Co., Ltd

Contact: Mr. Lin

Phone: 18925770398

E-mail: cnhuac@163.com